Hello everyone, this article mainly revolves around the application of ED-XRF in the detection of plating in connectors.

Connectors, also known domestically as plug-in connectors, plugs, and sockets, are components that use the action of electrical signals or optical signals and mechanical forces to connect, disconnect, or convert circuits or light paths. They are used to connect electrical signals or optical signals between devices, components, equipment, and systems, transmitting signals or electromagnetic energy while ensuring that there is no signal distortion or energy loss between systems. Optical connectors are used wherever optical signals need to be connected. As one of the essential basic components for electrical connections in the overall circuit system, connectors have been widely used in aviation, aerospace, military equipment, communications, computers, automobiles, industry, household appliances, and other fields.

Contact elements are the core components of connectors for electrical connection. They generally consist of an anode contact and a cathode contact, which complete electrical connections through the insertion of the cathode and anode contacts. The anode contact is a rigid component, typically in the shape of a cylinder (pin), a square column (pin), or a flat shape (blade). Anode contacts are usually made of brass or phosphor bronze. The cathode contact, also known as a socket, is a crucial component of the contact pair, which relies on its elastic structure to undergo elastic deformation when the pins are inserted, generating elastic force to establish close contact with the anode contact and complete the connection.

The surface treatment methods of the contact elements in the connector vary depending on functional requirements, with common methods including nickel plating, silver plating, tin plating, and gold plating.

Our ED-XRF, with its unique optical path design and a recent testing distance of 10% beam spread, is equipped with a high-precision XY manual slide rail for precise positioning of test samples, capable of satisfying the sequential testing of multiple samples. It is widely used in the plating thickness testing of various types of connectors.

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